Lace Lithography, a Norwegian deep tech startup, has raised $40 million in a Series A round to develop a next-generation chipmaking process, aiming to compete with industry leader ASML.
The round was led by Atomico (Sasha Vidiborskiy), with participation from M12 (Michael Stewart), Linse Capital, SETT, and Nysnø.
Lace Lithography is tackling the lithography process used to produce advanced AI chips, where light is traditionally used to etch intricate circuits onto silicon wafers. The company’s breakthrough approach uses a helium atom beam, promising unprecedented precision at the atomic scale.
Cofounders Bodil Holst and Adrià Salvador Palau bring decades of experience in atomic beam physics, instrumentation engineering, and applied AI. The startup has already developed prototypes and plans to have a pilot facility operational by 2029.
This innovative technology aims to address the growing demand for advanced semiconductors, potentially reshaping the future of chip manufacturing and supporting the next wave of AI-driven hardware.
